Benfer Multiplan 50-FI Self Levelling Compound 20kg

Fibre reinforced, suitable on plywood overlay

• Suitable on underfloor heating

• Fast curing, foot traffic after 2-3 hours*

• Flexible, polymer modified

• Low emission

• Easy to process, can be pump applied

• For layers 3-50 mm thick

• For interior application only

MULTIPLAN 50-FI is used for smoothening and levelling in layers of 1-50 mm thick. Suitable substrates are concrete floors in accordance with DIN 1045, heated and unheated cementbased screeds in accordance with DIN 18560, old, well bonded tile finishes and rapid cement-based screeds. MULTIPLAN 50-FI is also suitable for use on plywood overlay, on chipboard and on old wooden floorboards as well.

• On timber floor boards;

• On old substrates with bonded adhesive and levelling compound residues;

• For the restoration and repair of wooden floors and additionally for screeds and substrates in old and new construction;

• For producing flat, absorbent, high strength installation surfaces for textile and elastic floor finishes as well as for ceramic tiles;

• Suitable for use on heated substrates.